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Shenzhen Xinchenger Electronic Co.,Ltd Printed Circuit Board Manufacturer Multilayer&High Frequency PCB Blind Buried Vias Hole
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Microwave Amplifiers High Frequency HF PCB Boards With High Power and Low Noise Band

Shenzhen Xinchenger Electronic Co.,Ltd
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Microwave Amplifiers High Frequency HF PCB Boards With High Power and Low Noise Band

Brand Name : XCE

Model Number : XCEM

Certification : CE,ROHS, FCC,ISO9008,SGS,UL

Place of Origin : China

MOQ : 1pcs

Price : negotiation

Payment Terms : T/T,Western union

Supply Ability : 1, 000, 000 PCS / week

Delivery Time : 5-10 days

Packaging Details : inner: vacuum-packed bubble bag outer: carton box

Surface finish : Immersion gold

Board THK : 0.2mm

Product name : high frequency pcb

size : 15*6

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Microwave Amplifiers High Frequency PCB Boards With High Power Low Noise Band

Specification:

Wideband 18 to 40 GHz Amplifier High Frequency PCB


Board size: 15*6 cm

Material: Rogers

Board thickness: 0.2mm

Copper foil: 1OZ

Layer: 2

Model: XCEH

Parameter:

Min board thickness 2 layer 0.2mm
4 layer 0.4mm
6 layer 0.6mm
8 layer 0.8mm
10 layer 1.0mm
Max panel size 508*610mm
Board thickness tolerance  T≥0.8mm±8%,T<0.8mm±5%
Wall hole copper thickness   >0.025mm(1mil)
Finished hole 0.2mm-6.3mm
Min line width 4mil/4mil(0.1/0.1mm)
Min bonding pad space 0.1mm(4mil)
PTH aperture tolerance ±0.075mm(3mil)

Description:

High frequency PCBs with aluminum heat sink for telecommunication and aerospace industries using customer specific electrically and thermally conductive bonding films. Microwave PCB’s: XCE has enormous experience and technical expertise in the manufacturing of time critical, high technology RF circuits. The company works closely with its worldwide customers to deliver prototype-to-large volume manufacturing of circuits. During this process our engineering staff discusses with the customers’ staff to come up with the optimized designs for high quality, low cost and speedy delivery.

NPTH aperture tolerance ±0.05mm(2mil)
Hole site deviation ±0.05mm(2mil)
Profile tolerance ±0.10mm(4mil)
Board bend&warp ≤0.7%
Insulation resistance >1012Ωnormal
Through-hole resistance <300Ωnormal


Product Tags:

printed circuit board design

      

printed circuit board pcb

      
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